Cleaning liquid, and anticorrosive agent

ABSTRACT

In a cleaning liquid containing (A) an anticorrosive agent, and (B) a solvent, a compound represented by the following formula (1): 
     
       
         
         
             
             
         
       
     
     wherein, R represents a substituent group; m is an integer of 1 to 3; and n is an integer of 0 to 3, wherein provided that m is 2 or 3, R may be the same or different; or the following formula (2): 
       HS—(CH 2 ) x —OH  (2)
 
     wherein, x is an integer of no less than 3, is used as the anticorrosive agent (A).

This application is based on and claims the benefit of priority fromJapanese Patent Application Nos. 2011-288930 and 2011-288931, filed on28 Dec. 2011, the contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a cleaning liquid, and an anticorrosiveagent for copper or a copper-containing metal.

2. Related Art

Semiconductor devices are formed by laminating a metal wiring layer, alow dielectric layer, an insulating layer or the like on a substratesuch as a silicon wafer, and such semiconductor devices are manufacturedvia processing of each of these layers by a lithography method includingcarrying out an etching treatment using a resist pattern as a mask.

Residual matter derived from a resist film and a temporarily laminatedfilm (may be also referred to as “sacrificial film”) used in thelithography method, as well as the metal wiring layer and the lowdielectric layer generated in an etching step are eliminated using acleaning liquid so as not to be a hindrance for the semiconductordevice, and not to obstruct the following step(s).

Furthermore, in recent years, methods of forming wiring have beenadopted in which a damascene method is used, in accordance withincreased density and enhanced integration of semiconductor devices.According to such a method of forming wiring, copper, acopper-containing metal or the like that is susceptible to corrosion isemployed as a metal wiring material that constitutes a metal wiringlayer of a semiconductor device.

In the manufacturing methods of these semiconductor devices, analkaline, acidic or neutral cleaning liquid is used according to thetype of the residual matter to be eliminated, whereby corrosion ofcopper and copper-containing metals is a problem that results from thecleaning liquid. The problem of corrosion of the copper andcopper-containing metals is remarkable in the case in which an acidic oralkaline cleaning liquid is used. Therefore, development of a cleaningliquid that prevents these copper and copper-containing metals, etc.,from corrosion when cleaning a substrate has been demanded.

In order to solve the problem of corrosion of copper andcopper-containing metals, etc., resulting from such a cleaning liquid, acleaning liquid was proposed which contains as an anticorrosive agent,for example, an alcohol having no less than 2 carbon atoms in which atleast one mercapto group is included in the molecule, and a mercaptogroup and a hydroxyl group are bound to adjacent carbon atoms (seePatent Document

-   [Patent Document 1] Japanese Unexamined Patent Application,    Publication No. 2000-273663

SUMMARY OF THE INVENTION

However, although an effect of preventing corrosion can be found onmetals such as copper to some extent according to the cleaning liquidcontaining an anticorrosive agent described in Patent Document 1,further improvement of the effect of preventing corrosion has beendesired.

An object of the present invention is to provide a cleaning liquid, andan anticorrosive agent having a superior anticorrosive effect on copperor a copper-containing metal.

The present inventors thoroughly investigated in order to achieve theobject described above, and consequently found that a mercapto compoundhaving a specific structure has a superior anticorrosive effect, and isthus useful as an anticorrosive agent. In addition, the presentinventors found that the foregoing problems can be solved by adding themercapto compound as an anticorrosive agent to a cleaning liquid.Accordingly, the present invention was accomplished. Specifically, thepresent invention provides the following.

A first aspect of the present invention is a cleaning liquid containing(A) a mercapto compound, and (B) a solvent,

in which the mercapto compound (A) is at least one selected fromcompounds represented by the following formula (1):

in the formula (1), R represents a group selected from the groupconsisting of a hydroxyl group, an alkyl group having 1 to 4 carbonatoms, an alkoxy group having 1 to 4 carbon atoms, an alkylthio grouphaving 1 to 4 carbon atoms, a hydroxyalkyl group having 1 to 4 carbonatoms, a mercaptoalkyl group having 1 to 4 carbon atoms, a halogenatedalkyl group having 1 to 4 carbon atoms and a halogen atom; m is aninteger of 1 to 3; and n is an integer of 0 to 3, wherein provided thatm is 2 or 3, R may be the same or different; and the following formula(2):

HS—(CH₂)_(x)—OH  (2)

in the formula (2), x is an integer of no less than 3.

A second aspect of the present invention is an anticorrosive agent forcopper or a copper-containing metal, consisting of a compoundrepresented by the above formula (1) or formula (2).

According to the present invention, a cleaning liquid, and ananticorrosive agent having a superior anticorrosive effect on copper ora copper-containing metal can be provided.

DETAILED DESCRIPTION OF THE INVENTION Cleaning Liquid

The cleaning liquid according to the present invention contains (A) amercapto compound, and (B) a solvent. The mercapto compound (A) is atleast one compound selected from an aromatic mercapto compoundrepresented by the formula (1), and a linear mercapto alcohol compoundrepresented by the formula (2) described below.

(A) Mercapto Compound

The cleaning liquid is used for cleaning an object to be cleaned suchas, for example, substrates and the like having a wiring formed thereonwith copper, a copper-containing metal or the like. By thus cleaning,residual matter and the like attached to the surface of the object to becleaned, derived from a resist film and a temporarily laminated film,and from the metal wiring layer and the low dielectric layer generatedin an etching step are eliminated from the surface of the object to becleaned. In the case in which the cleaning liquid contains as themercapto compound (A), one or more compounds selected from a compoundrepresented by the following formula (1), and a linear mercapto alcoholcompound represented by the following formula (2), corrosion of wiringconsisting of copper or a copper-containing metal can be inhibited,thereby enabling the suppression of changes in a value of resistanceduring cleaning, and occurrences of breaking of the wire.

In the formula (1), R represents a group selected from the groupconsisting of a hydroxyl group, an alkyl group having 1 to 4 carbonatoms, an alkoxy group having 1 to 4 carbon atoms, an alkylthio grouphaving 1 to 4 carbon atoms, a hydroxyalkyl group having 1 to 4 carbonatoms, a mercaptoalkyl group having 1 to 4 carbon atoms, a halogenatedalkyl group having 1 to 4 carbon atoms and a halogen atom; m is aninteger of 1 to 3; and n is an integer of 0 to 3, wherein provided thatm is 2 or 3, R may be the same or different.

HS—(CH₂)_(x)—OH  (2)

In the formula (1), x is an integer of no less than 3.

Specific examples of the case in which R represents an alkyl grouphaving 1 to 4 carbon atoms which may have a hydroxyl group in theformula (1) include a methyl group, an ethyl group, a n-propyl group, aniso-propyl group, a n-butyl group, an iso-butyl group, a sec-butylgroup, and a tert-butyl group. Among these alkyl groups, a methyl group,a hydroxymethyl group or an ethyl group is preferred since suitablesolubility in a solvent can be attained, and a methyl group or ahydroxymethyl group is more preferred since the anticorrosive effect isfurther improved.

Specific examples of the case in which R represents an alkoxy grouphaving 1 to 4 carbon atoms in the formula (1) include a methoxy group,an ethoxy group, a n-propyloxy group, an iso-propyloxy group, an-butyloxy group, an iso-butyloxy group, a sec-butyloxy group, and atert-butyloxy group. Among these alkoxy groups, a methoxy group or anethoxy group is preferred since suitable solubility in a solvent can beattained, and a methoxy group is more preferred since the anticorrosiveeffect is further improved.

Specific examples of the case in which R represents an alkylthio grouphaving 1 to 4 carbon atoms in the formula (1) include a methylthiogroup, an ethylthio group, a n-propylthio group, an iso-propylthiogroup, a n-butylthio group, an iso-butylthio group, a sec-butylthiogroup, and a tert-butylthio group. Among these alkylthio groups, amethylthio group or an ethylthio group is preferred since suitablesolubility in a solvent can be attained, and a methylthio group is morepreferred since the anticorrosive effect is further improved.

Specific examples of the case in which R represents a hydroxyalkyl grouphaving 1 to 4 carbon atoms in the formula (1) include a hydroxymethylgroup, a 2-hydroxyethyl group, a 1-hydroxyethyl group, a3-hydroxy-n-propyl group, a 4-hydroxy-n-butyl group, and the like. Amongthese hydroxyalkyl groups, a hydroxymethyl group, a 2-hydroxyethyl groupor a 1-hydroxyethyl group is preferred since suitable solubility in asolvent can be attained, and a hydroxymethyl group is more preferredsince the anticorrosive effect is further improved.

Specific examples of the case in which R represents a mercaptoalkylgroup having 1 to 4 carbon atoms in the formula (1) include amercaptomethyl group, a 2-mercaptoethyl group, a 1-mercaptoethyl group,a 3-mercapto-n-propyl group, a 4-mercapto-n-butyl group, and the like.Among these mercaptoalkyl groups, a mercaptomethyl group, a2-mercaptoethyl group or a 1-mercaptoethyl group is preferred sincesuitable solubility in a solvent can be attained, and a mercaptomethylgroup is more preferred since the anticorrosive effect is furtherimproved.

In the case in which R represents a halogenated alkyl group having 1 to4 carbon atoms in the formula (1), examples of the halogen atom includedin the halogenated alkyl group include fluorine, chlorine, bromine,iodine, and the like. Specific examples of the case in which Rrepresents a halogenated alkyl group having 1 to 4 carbon atoms includea chloromethyl group, a bromomethyl group, an iodomethyl group, afluoromethyl group, a dichloromethyl group, a dibromomethyl group, adifluoromethyl group, a trichloromethyl group, a tribromomethyl group, atrifluoromethyl group, a 2-chloroethyl group, a 2-bromoethyl group, a2-fluoroethyl group, a 1,2-dichloroethyl group, a 2,2-difluoroethylgroup, a 1-chloro-2-fluoroethyl group, a 3-chloro-n-propyl group, a3-bromo-n-propyl group, a 3-fluoro-n-propyl group, a 4-chloro-n-butylgroup, and the like. Among these halogenated alkyl groups, achloromethyl group, a bromomethyl group, an iodomethyl group, afluoromethyl group, a dichloromethyl group, a dibromomethyl group, adifluoromethyl group, a trichloromethyl group, a tribromomethyl group ora trifluoromethyl group is preferred, and a chloromethyl group, adichloromethyl group, a trichloromethyl group or a trifluoromethyl groupis more preferred since the anticorrosive effect is further improved.

In the case in which R represents a halogen atom in the formula (1),specific examples of the halogen atom include fluorine, chlorine,bromine, and iodine.

In the formula (1), m is an integer of 1 to 3, and more preferably 1.Provided that m is 2 or 3, R may be the same or different.

In the compound represented by the formula (1), the position ofsubstitution with R on the benzene ring is not particularly limited.Since a superior anticorrosive effect is likely to be achieved, theposition of substitution with R on the benzene ring is preferably ameta- or para-position with respect to the position at which—(CH₂)_(n)—SH binds.

As the compound represented by the formula (1), due to superioranticorrosive properties for copper or a copper-containing metal, andsuperior stability in the cleaning liquid, a compound having at leastone group selected from the group consisting of an alkyl group, ahydroxyalkyl group and a mercaptoalkyl group as R is preferred, and acompound having one group selected from the group consisting of an alkylgroup, a hydroxyalkyl group and a mercaptoalkyl group as R is morepreferred. In the case in which the compound represented by the formula(1) has one group selected from the group consisting of an alkyl group,a hydroxyalkyl group and a mercaptoalkyl group as R, the position ofsubstitution with an alkyl group, a hydroxyalkyl group, or amercaptoalkyl group on the benzene ring is preferably a meta- orpara-position and more preferably a para-position with respect to theposition at which —(CH₂)_(n)—SH binds.

In the formula (1), n is an integer of 0 to 3. Due to ease inpreparation and availability of the compound n is preferably 0 or 1, andmore preferably 0.

Specific examples of the compound represented by the formula (1) includep-mercaptophenol, p-thiocresol, m-thiocresol,4-(methylthio)benzenethiol, 4-methoxybenzenethiol,3-methoxybenzenethiol, 4-ethoxybenzenethiol, 4-isopropyloxybenzenethiol, 4-tert-butoxybenzenethiol, 3,4-dimethoxy benzenethiol,3,4,5-trimethoxybenzenethiol, 4-ethylbenzenethiol, 4-isopropylbenzenethiol, 4-n-butylbenzenethiol, 4-tert-butylbenzenethiol,3-ethylbenzenethiol, 3-isopropyl benzenethiol, 3-n-butylbenzenethiol,3-tert-butylbenzenethiol, 3,5-dimethyl benzenethiol, 3,4-dimethylbenzenethiol, 3-tert-butyl-4-methylbenzenethiol,3-tert-4-methylbenzenethiol, 3-tert-butyl-5-methylbenzenethiol,4-tert-butyl-3-methylbenzenethiol, 4-mercaptobenzyl alcohol,3-mercaptobenzyl alcohol, 4-(mercaptomethyl)phenol,3-(mercaptomethyl)phenol, 4-fluorobenzenethiol, 3-fluorobenzenethiol,4-chlorobenzenethiol, 3-chlorobenzenethiol, 4-bromobenzenethiol,4-iodobenzenethiol, 3-bromobenzenethiol, 3,4-dichlorobenzenethiol,3,5-dichlorobenzenethiol, 3,4-difluorobenzenethiol,3,5-difluorobenzenethiol, 4-mercaptocatechol,2,6-di-tert-butyl-4-mercaptophenol,3,5-di-tert-butyl-4-methoxybenzenethiol, 4-bromo-3-methylbenzenethiol,4-(trifluoromethyl)benzenethiol, 3-(trifluoromethyl)benzenethiol,3,5-bis(trifluoromethyl)benzenethiol, 4-methylthiobenzenethiol,4-ethylthiobenzenethiol, 4-n-butylthiobenzenethiol, and4-tert-butylthiobenzenethiol, and the like. Among these compounds, dueto high anticorrosive effects on copper and copper-containing metals,and favorable availability, p-mercaptophenol, p-thiocresol,m-thiocresol, 4-(methylthio)benzenethiol, 4-methoxybenzenethiol,4-ethylbenzenethiol, 4-isopropyl benzenethiol, 4-fluorobenzenethiol,4-chlorobenzenethiol, and 4-bromobenzenethiol are more preferred. Inaddition, due to high anticorrosive effects on copper andcopper-containing metals, and superior stability in the cleaning liquid,4-mercaptobenzyl alcohol and 4-(mercaptomethyl)phenol are alsopreferred.

In the formula (2), x is an integer of no less than 3, and the upperlimit thereof is not particularly limited within the range not resultingin impairment of the object of the present invention. In light of theability to favorably inhibit corrosion of copper and copper-containingmetals resulting from the cleaning liquid, x is preferably an integer ofno less than 3 and no greater than 10, and more preferably an integer ofno less than 3 and no greater than 9. When the compound in which x fallswithin such a range is used as an anticorrosive agent, the anticorrosiveagent is likely to be dissolved in the cleaning liquid, whereby afavorable anticorrosive effect can be readily achieved. Also, in thiscase, when the object to be cleaned after cleaning is rinsed with water,deposition of the compound represented by the formula (2) as ananticorrosive agent can be suppressed.

Although the compound in which x is an integer of less than 3 is readilydissolved in the cleaning liquid, it exhibits an inferior anticorrosiveeffect. Although the compound in which x is greater than 10 exhibits afavorable anticorrosive effect, when a cleaning liquid containing such acompound is used, rinsing with water after cleaning may cause depositionon the surface of the object to be cleaned. Therefore, when a cleaningliquid containing the compound in which x is an integer of greater than10 is used, the cleaning is preferably followed by rinsing with anorganic solvent, and then rinsing with water as needed.

Suitable examples of the compound represented by the formula (2)include:

HS—(CH₂)₃—OH;

HS—(CH₂)₄—OH;

HS—(CH₂)₅—OH;

HS—(CH₂)₆—OH;

HS—(CH₂)₇—OH;

HS—(CH₂)₈—OH;

HS—(CH₂)₉—OH; and

HS—(CH₂)₁₀—OH.

The content of the mercapto compound (A) in the cleaning liquid is notparticularly limited as long as it does not inhibit the cleaning effectof the cleaning liquid, and the mercapto compound (A) can behomogenously dissolved in the cleaning liquid. The content of themercapto compound (A) in the cleaning liquid is preferably 0.05 to 5.0%by mass, and more preferably 0.1 to 1.0% by mass with respect to themass of the cleaning liquid. When the mercapto compound (A) is added tothe cleaning liquid in an amount falling within such a range, in thecase in which the object to be cleaned after cleaning with the cleaningliquid is rinsed with water or the like, deposition of the mercaptocompound (A) is readily suppressed, while achieving favorableanticorrosive effects of metals. It is to be noted that two or moretypes of the mercapto compound (A) may be used in combination in thecleaning liquid.

(B) Solvent

The cleaning liquid contains (B) a solvent that dissolves the mercaptocompound (A), and (C) an alkaline compound or acidic compound as well as(D) other additives described later. The solvent is not particularlylimited as long as it can homogenously dissolve the components containedin the cleaning liquid, and any one of water, an organic solvent, and anaqueous solution of an organic solvent may be used.

Although the organic solvent may be either a water soluble organicsolvent or a hydrophobic organic solvent, a water soluble organicsolvent is preferred. The organic solvent included in the solvent ispreferably water soluble, since the cleaning liquid remaining on thesurface of the object to be cleaned can be easily eliminated by rinsingthe object to be cleaned with water.

Suitable examples of the water soluble organic solvent includesulfoxides such as dimethyl sulfoxide; sulfones such as dimethylsulfone, diethyl sulfone, bis(2-hydroxyethyl)sulfone, and tetramethylenesulfone; amides such as N,N-dimethyl formamide, N-methylformamide,N,N-dimethylacetamide, N-methylacetamide, and N,N-diethyl acetamide;lactams such as N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone,N-hydroxymethyl-2-pyrrolidone, and N-hydroxyethyl-2-pyrrolidone;lactones such as β-propiolactone, γ-butyrolactone, γ-valerolactone,δ-valerolactone, γ-caprolactone, and ∈-caprolactone; imidazolidinonessuch as 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone,and 1,3-diisopropyl-2-imidazolidinone; polyhydric alcohols andderivatives thereof such as ethylene glycol, ethylene glycol monomethylether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether,ethylene glycol monoacetate, ethylene glycol monomethyl ether acetate,ethylene glycol monoethyl ether acetate, diethylene glycol, diethyleneglycol monoacetate, diethylene glycol monomethyl ether, diethyleneglycol monoethyl ether, diethylene glycol monobutyl ether, propyleneglycol, propylene glycol monomethyl ether, propylene glycol monoethylether, propylene glycol monopropyl ether, dipropylene glycol monomethylether, glycerin, 1,2-butylene glycol, 1,3-butylene glycol, and2,3-butylene glycol; alkanolamines such as monoethanolamine,diethanolamine, triethanolamine, 2-(2-aminoethoxy)ethanol, N,N-dimethylethanolamine, N,N-diethyl ethanolamine, N,N-dibutylethanolamine,N-methylethanolamine, N-ethylethanolamine, N-butylethanolamine,N-methyldiethanolamine, monoisopropanolamine, diisopropanolamine, andtriisopropanolamine.

Among these water soluble organic solvents, dimethyl sulfoxide,propylene glycol monomethyl ether, propylene glycol monoethyl ether,propylene glycol monopropyl ether, diethylene glycol monoethyl ether,and diethylene glycol monobutyl ether are more preferred.

When the solvent contained in the cleaning liquid includes a watersoluble organic solvent, both hydrophilic residues and hydrophobicresidues attached to the object to be cleaned can be easily eliminated.Therefore, it is preferred to use a water soluble organic solvent incombination with water.

The content of the solvent in the cleaning liquid is determined as amatter of course, depending on the used amount of the componentsdissolved in the cleaning liquid. When the solvent contained in thecleaning liquid includes water and a water soluble organic solvent, thecontent of the water soluble organic solvent in the cleaning liquid ispreferably 10 to 90% by mass, and more preferably 20 to 80% by mass. Inthe case in which the cleaning liquid does not contain water, thecontent of the aqueous organic solvent in the cleaning liquid ispreferably 50 to 99% by mass, and more preferably 75 to 95% by mass.

(C) Alkaline Compound, or Acidic Compound

As the cleaning liquid, any of an alkaline cleaning liquid, an acidiccleaning liquid, and a neutral cleaning liquid may be used, which may beappropriately selected according to the type of the residual matter tobe eliminated attached to the object to be cleaned. Of these cleaningliquids, an alkaline, or acidic cleaning liquid is preferred due tohaving a superior cleaning effect. When the cleaning liquid is analkaline, or acidic cleaning liquid, an alkaline compound, or an acidiccompound is blended into the cleaning liquid. However, with respect tothe alkaline cleaning liquid, it is not always necessary to blend analkaline compound into the cleaning liquid when the solvent contains analkanolamine that is a basic compound.

When the cleaning liquid is alkaline, the alkaline compound blended intothe cleaning liquid is appropriately selected from an organic or aninorganic alkaline compound. As the organic alkaline compound, a varietyof basic nitrogen-containing organic compounds may be used. Among thebasic nitrogen-containing organic compounds, a quaternary ammoniumhydroxide is preferred. Suitable examples of a quaternary ammoniumhydroxide include tetramethylammonium hydroxide, tetraethylammoniumhydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide,ethyltrimethylammonium hydroxide, dimethyl diethylammonium hydroxide,methyltriethylammonium hydroxide, methyltripropylammonium hydroxide,methyltributylammonium hydroxide, benzyltrimethylammonium hydroxide, and(2-hydroxyethyl)trimethylammonium hydroxide, and the like. Among thesequaternary ammonium hydroxides, since a favorable cleaning effect of thecleaning liquid can be achieved, tetramethylammonium hydroxide,tetrapropylammonium hydroxide, tetrabutylammonium hydroxide,benzyltrimethylammonium hydroxide and tetraethylammonium hydroxide arepreferred, and tetramethylammonium hydroxide or tetrabutylammoniumhydroxide is more preferred. The organic alkaline compounds may be usedin combination of two or more thereof.

The amount of the organic alkaline compound blended into the cleaningliquid may vary depending on the basicity of the compound, andtypically, the amount is preferably 1 to 20% by mass, and morepreferably 2 to 15% by mass with respect to the mass of the cleaningliquid.

The inorganic alkaline compound is not particularly limited within therange that does not hamper the object of the present invention, and avariety of compounds may be used. Suitable examples of the inorganicalkaline compound include alkali metal hydroxides such as sodiumhydroxide, potassium hydroxide, and rubidium hydroxide. The inorganicalkaline compounds may be used in combination of two or more thereof.

The amount of the inorganic alkaline compound blended into the cleaningliquid may vary depending on the basicity of the compound, andtypically, the amount is preferably 0.1 ppm by mass to 1% by mass, andmore preferably 1 ppm by mass to 0.5% by mass with respect to the massof the cleaning liquid.

When the cleaning liquid is acidic, the acidic compound blended into thecleaning liquid is appropriately selected from among protonic acidswithin the range that does not hamper the object of the presentinvention. Specific examples of a suitable acidic compound includeprotonic acids such as hydrochloric acid, hydrofluoric acid, sulfuricacid, nitric acid, formic acid, acetic acid, propionic acid, butyricacid, isobutyric acid, valeric acid, isovaleric acid, lactic acid,oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid,citric acid, glycolic acid, diglycolic acid, phosphoric acid,methanesulfonic acid, trifluoroacetic acid, and trifluoromethanesulfonic acid. The acidic compound may be used in combination of two ormore thereof.

The amount of the acidic compound blended into the cleaning liquid mayvary depending on the acidity of the compound, and typically, the amountis preferably 0.1 to 20% by mass, more preferably 0.5 to 15% by masswith respect to the mass of the cleaning liquid. 1.0 to 10% by mass isstill more preferable.

(D) Other Additives

The cleaning liquid may contain in addition to the mercapto compound(A), and the alkaline or acidic compound, a variety of additives thatmay be commonly blended into cleaning liquids, within a range which doesnot hamper the object of the present invention. Suitable examples ofother additives which may be blended into the cleaning liquid includesurfactants, antioxidants, antiseptic agents, and the like.

The amount of the other additive used may be appropriately determinedaccording to the type of the additive. The other additive is blendedinto the cleaning liquid in an amount falling within the range commonlyused in cleaning liquids.

Cleaning Method of the Object to be Cleaned

The object to be cleaned which is cleaned by the cleaning liquidcontaining the mercapto compound (A) is not particularly limited. Whenthe object to be cleaned is a substrate having a metal layer consistingof copper or a copper-containing alloy, corrosion of the metal layer canbe favorably inhibited even in the case in which the substrate iscleaned with a cleaning liquid containing the mercapto compound (A). Assuitable examples of preferable substrate having a metal layerconsisting of copper or a copper-containing alloy, substrates producedby laminating a metal wiring layer, a low dielectric layer, aninsulating layer, etc., on a substrate such as a silicon wafer to form asemiconductor device are preferable.

The cleaning method of the object to be cleaned is not particularlylimited as long as it is a commonly employed method. Specifically, thecleaning liquid is brought into contact with the object to be cleanedfor 1 to 40 min to carry out the treatment using, for example, animmersion method, a puddling method, a showering method or the like. Thecleaning is usually carried out at room temperature; however, thetemperature of the cleaning liquid may be elevated to about 85° C. inorder to improve the cleaning effect.

EXAMPLES

Hereinafter, the present invention will be explained in more detail byway of Examples, but the present invention is not limited to theseExamples.

Examples 1 to 10, and Comparative Examples 1 to 4

The compounds shown in Table 2 were used as anticorrosive agents. Eachcomponent contained in the cleaning liquid was mixed at each percentageshown in Table 1 below to prepare a homogenously dissolved cleaningliquid. It is to be noted that in Comparative Example 1, the content ofwater in the cleaning liquid was 50.30% by mass since the anticorrosiveagent was not used.

TABLE 1 Composition (% by mass) Anticorrosive agent 0.30 Dimethylsulfoxide 25.02 Diethylene glycol monobutyl ether 16.68 Water 50.00Tetramethylammonium hydroxide 8.00

Using the cleaning liquid thus obtained, an anticorrosion test wasperformed according to the method described below. The amount ofcorrosion of the copper film (nm) found when the anticorrosion test wasperformed using each cleaning liquid of the Examples and ComparativeExamples is shown in Table 2.

Anticorrosion Test Method

A test piece cut out to give a size of 4 cm×2 cm from a siliconsubstrate provided with a copper film having a film thickness of 30 nmformed on the surface thereof by a sputtering method was used as anobject to be cleaned. As the test vessel, a 100 ml glass beaker wasused. The test piece was leaned against the inner wall of the beakersuch that the short side of the test piece was in contact with thebottom face of the beaker, and the test was performed. After eachcleaning liquid of the Examples, and Comparative Examples which had beenwarmed to 50° C. was slowly poured into a beaker in which the test piecehad been placed, the test piece was immersed in the cleaning liquid for10 min while the temperature of the cleaning liquid was maintained at50° C. During the immersion, the cleaning liquid was stirred by astirring device equipped with a single propeller blade, at a rotationfrequency of 200 rpm. After completing the immersion, the test piece waspulled up from the cleaning liquid, the surface of the test piece wasrinsed with water, and then, nitrogen was sprayed on the surface of thetest piece to dry the test piece. The values of the surface resistanceof the surface of the test piece on which the copper film was formedafter drying were measured by a VR-70 (manufactured by Kokusai DenkiKabushiki Kaisha). The amount of corrosion of the copper film wascalculated from the value of surface resistance.

TABLE 2 Amount of corrosion of the Anticorrosive agent cupper film (nm)Example 1 p-Mercaptophenol 0.09 Example 2 p-Thiocresol 0.22 Example 3m-Thiocresol 0.18 Example 4 4-(Methylthio) benzenethiol 0.21 Example 54-Methoxybenzenethiol 0.37 Example 6 4-Ethylbenzenethiol 0.19 Example 74-Isopropylbenzenethiol 0.17 Example 8 4-Fluorobenzenethiol 0.22 Example9 4-Chlorobenzenethiol 0.13 Example 10 4-Bromobenzenethiol 0.04Comparative example 1 None No less than 30.00 Comparative example 2Thioglycerol 1.71 Comparative example 3 Benzylmercaptan 1.01 Comparativeexample 4 Thiophenol 2.04

According to Examples 1 to 10, and Comparative Example 1, it can beunderstood that the cleaning liquid containing the aromatic mercaptocompound represented by the formula (1) as an anticorrosive agent canextremely favorably inhibit corrosion of copper in the cleaning step. Onthe other hand, according to Comparative Examples 2 to 4, it can beunderstood that even in the case of a compound having a mercapto group,the cleaning liquid in which a compound other than that represented bythe formula (1) or formula (2) was used as an anticorrosive agentresults in corrosion of the copper film to some extent although thecorrosion of the copper film is inhibited.

Examples 11 and 12

The cleaning liquid of Example 11 was prepared similarly to Example 2except that the content of p-thiocresol was changed from 0.30% by massto 0.10% by mass, and that the content of water was changed from 50.00%by mass to 50.20% by mass. In addition, the cleaning liquid of Example12 was prepared similarly to Example 2 except that the content ofp-thiocresol was changed from 0.30% by mass to 0.70% by mass, and thatthe content of water was changed from 50.00% by mass to 49.60% by mass.

When the anticorrosion test was performed using the cleaning liquids ofExamples 11 and 12 similarly to Example 2, the amount of corrosion ofthe copper film was 0.35 nm in the case of the cleaning liquid ofExample 11, whereas the amount of corrosion of the copper film was 0.15nm in the case of the cleaning liquid of Example 12.

According to Example 2 and Example 11, it can be understood that whenthe content of the anticorrosive agent in the cleaning liquid waslowered to about 0.10% by mass, superior anticorrosive effect can bemaintained although the amount of corrosion of the copper film somewhatincreases. Also, according to Example 2 and Example 12, it can beunderstood that an increase in the content of the anticorrosive agent inthe cleaning liquid enables the anticorrosive effect of the cleaningliquid to be further improved.

Example 13, and Comparative Example 5

The compounds shown in Table 4 were used as anticorrosive agents. Eachcomponent contained in the cleaning liquid was mixed at each percentageshown in Table 3 below to prepare a homogeneously dissolved cleaningliquid. It is to be noted that in Comparative Example 5, the content ofwater in the cleaning liquid was 50.30% by mass since the anticorrosiveagent was not used.

TABLE 3 Composition (% by mass) Anticorrosive agent 0.30 Dimethylsulfoxide 29.52 Diethylene glycol monobutyl ether 19.68 Water 50.00Potassium hydroxide 0.5

TABLE 4 Amount of corrosion of the cupper film Anticorrosive agent (nm)Example 13 p-thiocresol 0.21 Comparative example 5 None No less than30.00

According to Example 2 and Example 13, and Comparative Example 5, it canbe understood that in the alkaline cleaning liquids, irrespective of thetype of alkaline substance included in the cleaning liquid, use of thearomatic mercapto compound represented by the formula (1) as ananticorrosive agent enables corrosion of copper to be extremelyfavorably inhibited in the cleaning step.

Example 14 and Comparative Example 6

The compounds shown in Table 6 were used as anticorrosive agents. Eachcomponent contained in the cleaning liquid was mixed at each percentageshown in Table 5 below to prepare a homogeneously dissolved cleaningliquid. It is to be noted that in Comparative Example 6, the content ofwater in the cleaning liquid was 50.30% by mass since the anticorrosiveagent was not used.

TABLE 5 Composition (% by mass) Anticorrosive agent 0.30 Dimethylsulfoxide 23.82 Diethylene glycol monobutyl ether 15.88 Water 50.00Malonic acid 10.00

TABLE 6 Amount of corrosion of the cupper film Anticorrosive agent (nm)Example 14 p-thiocresol 0.50 Comparative example 6 None No less than30.00

According to Example 14 and Comparative Example 6, it can be understoodthat also in acidic cleaning liquids, use of the aromatic mercaptocompound represented by the formula (1) as an anticorrosive agentenables corrosion of copper to be extremely favorably inhibited in thecleaning step.

Examples 15 to 17, and Comparative Example 7

The compounds shown in Table 8 were used as anticorrosive agents. Eachcomponent contained in the cleaning liquid was mixed at each percentageshown in Table 7 below to prepare a homogeneously dissolved cleaningliquid. It is to be noted that for comparison with Examples 15 to 17,the results of Comparative Examples 1 and 2 are shown together in Table8.

TABLE 7 Composition (% by mass) Anticorrosive agent 0.30 Dimethylsulfoxide 25.02 Diethylene glycol monobutyl ether 16.68 Water 50.00Tetramethylammonium hydroxide 8.00

Using the cleaning liquid thus obtained, an anticorrosion test wasperformed according to a similar method to Example 1. The amount ofcorrosion of the copper film (nm) found when the anticorrosion test wasperformed using each cleaning liquid of the Examples and ComparativeExamples is shown in Table 8.

TABLE 8 Amount of corrosion of the cupper film Anticorrosive agent (nm)Example 15 HS—(HC₂)₃—OH 0.80 Example 16 HS—(CH₂)₆—OH 0.72 Example 17HS—(CH₂)₉—OH 0.05 Comparative example 1 None No less than 30.00Comparative example 2 Thioglycerol 1.71 Comparative example 7Mercaptoethanol 1.36

According to Examples 15 to 17, and Comparative Example 1, it can beunderstood that the cleaning liquid containing the linear mercaptoalcohol compound represented by the formula (2) as an anticorrosiveagent can extremely favorably inhibit corrosion of copper in thecleaning step. On the other hand, according to Comparative Examples 2and 7, it can be understood that even in the case of a compound having amercapto group, the cleaning liquid in which a compound other than thatrepresented by the formula (1) or formula (2) was used as ananticorrosive agent results in corrosion of the copper film to someextent although the corrosion of the copper film is inhibited.

Examples 18 and 19

The cleaning liquid of Example 18 was prepared similarly to Example 16except that the content of mercaptohexanol (HS—(CH₂)₆—OH) was changedfrom 0.30% by mass to 0.10% by mass, and that the content of water waschanged from 50.00% by mass to 50.20% by mass. In addition, the cleaningliquid of Example 19 was prepared similarly to Example 16 except thatthe content of mercaptohexanol was changed from 0.30% by mass to 0.70%by mass, and that the content of water was changed from 50.00% by massto 49.60% by mass.

When the anticorrosion test was performed using the cleaning liquids ofExamples 18 and 19 similarly to Example 1, the amount of corrosion ofthe copper film was 0.85 nm in the case of the cleaning liquid ofExample 18, whereas the amount of corrosion of the copper film was 0.50nm in the case of the cleaning liquid of Example 19.

According to Example 16 and Example 18, it can be understood that whenthe content of the linear mercapto alcohol compound in the cleaningliquid was lowered to about 0.10% by mass, superior anticorrosive effectcan be maintained although the amount of corrosion of the copper filmsomewhat increases. Also, according to Example 16 and Example 19, it canbe understood that an increase in the content of the linear mercaptoalcohol compound in the cleaning liquid enables the anticorrosive effectof the cleaning liquid to be further improved.

Example 20

The compound shown in Table 10 was used as an anticorrosive agent. Eachcomponent contained in the cleaning liquid was mixed at each percentageshown in Table 9 below to prepare a homogeneously dissolved cleaningliquid. It is to be noted that for comparison, the results ofComparative Example 5 are shown together with those of Example 20 inTable 10.

TABLE 9 Composition (% by mass) Anticorrosive agent 0.30 Dimethylsulfoxide 29.52 Diethylene glycol monobutyl ether 19.68 Water 50.00Potassium hydroxide 0.5

TABLE 10 Amount of corrosion of the cupper film Anticorrosive agent (nm)Example 20 HS—(CH₂)₆—OH 0.62 Comparative example 5 None No less than30.00

According to Example 16 and Example 20, and Comparative Example 5, itcan be understood that in the alkaline cleaning liquids, irrespective ofthe type of alkaline substance included in the cleaning liquid, use ofthe linear mercapto alcohol compound represented by the formula (2) asan anticorrosive agent enables corrosion of copper to be extremelyfavorably inhibited in the cleaning step.

Example 21

The compound shown in Table 12 was used as an anticorrosive agent. Eachcomponent contained in the cleaning liquid was mixed at each percentageshown in Table 11 below to prepare a homogeneously dissolved cleaningliquid. It is to be noted that for comparison, the results ofComparative Example 6 are shown together with those of Example 21 inTable 12.

TABLE 11 Composition (% by mass) Anticorrosive agent 0.30 Dimethylsulfoxide 23.82 Diethylene glycol monobutyl ether 15.88 Water 50.00Malonic acid 10.00

TABLE 12 Amount of corrosion of the cupper film Anticorrosive agent (nm)Example 21 HS—(CH₂)₆—OH 0.75 Comparative example 6 None No less than30.00

According to Example 21 and Comparative Example 6, it can be understoodthat also in the acidic cleaning liquid, use of the linear mercaptocompound represented by the formula (2) as an anticorrosive agentenables corrosion of copper to be extremely favorably inhibited in thecleaning step.

What is claimed is:
 1. A cleaning liquid comprising (A) a mercaptocompound, and (B) a solvent, wherein the mercapto compound (A) is atleast one selected from compounds represented by the following formula(1):

wherein, R represents a group selected from the group consisting of ahydroxyl group, an alkyl group having 1 to 4 carbon atoms, an alkoxygroup having 1 to 4 carbon atoms, an alkylthio group having 1 to 4carbon atoms, a hydroxyalkyl group having 1 to 4 carbon atoms, amercaptoalkyl group having 1 to 4 carbon atoms, a halogenated alkylgroup having 1 to 4 carbon atoms and a halogen atom; m is an integer of1 to 3; and n is an integer of 0 to 3, wherein provided that m is 2 or3, R may be the same or different; and the following formula (2):HS—(CH₂)_(x)—OH  (2) wherein, x is an integer of no less than
 3. 2. Thecleaning liquid according to claim 1, wherein the mercapto compound (A)is the compound represented by the above formula (1).
 3. The cleaningliquid according to claim 2, wherein the position of binding of R is ameta- or para-position with respect to the position at which—(CH₂)_(n)—SH binds.
 4. The cleaning liquid according to claim 2,wherein R represents a hydroxyl group.
 5. The cleaning liquid accordingto claim 1, wherein the mercapto compound (A) is the compoundrepresented by the above formula (2).
 6. The cleaning liquid accordingto claim 5, wherein x is an integer of no less than 3 and no greaterthan
 10. 7. The cleaning liquid according to claim 1, which is used forcleaning a substrate having a metal layer consisting of copper or acopper-containing alloy.
 8. An anticorrosive agent for copper or acopper-containing alloy, the anticorrosive agent consisting of acompound represented by the following formula (1):

wherein, R represents a group selected from the group consisting of ahydroxyl group, an alkyl group having 1 to 4 carbon atoms, an alkoxygroup having 1 to 4 carbon atoms, an alkylthio group having 1 to 4carbon atoms, a hydroxyalkyl group having 1 to 4 carbon atoms, amercaptoalkyl group having 1 to 4 carbon atoms, a halogenated alkylgroup having 1 to 4 carbon atoms and a halogen atom; m is an integer of1 to 3; and n is an integer of 0 to 3, wherein provided that m is 2 or3, R may be the same or different, or the following formula (2):HS—(CH₂)_(x)—OH  (2) wherein, x is an integer of no less than 3.